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Chemical vapour deposition of epitaxial rhombohedral BN thin films on SiC substrates

机译:在SiC衬底上化学气相沉积外延菱形BN薄膜

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摘要

Epitaxial growth of rhombohedral boron nitride (r-BN) on different polytypes of silicon carbide (SiC) is demonstrated using thermally activated hot-wall chemical vapour deposition and triethyl boron and ammonia as precursors. With respect to the crystalline quality of the r-BN films, we investigate the influence of the deposition temperature, the precursor ratio (N/B) and the addition of a minute amount of silicon to the gas mixture. From X-ray diffraction and transmission electron microscopy, we find that the optimal growth temperature for epitaxial r-BN on the Si-face of the SiC substrates is 1500 degrees C at a N/B ratio of 642 and silicon needs to be present not only in the gas mixture during deposition but also on the substrate surface. Such conditions result in the growth of films with a c-axis identical to that of the bulk material and a thickness of 200 nm, which is promising for the development of BN films for electronic applications.
机译:使用热活化的热壁化学气相沉积以及三乙基硼和氨作为前驱体,证明了菱形氮化硼(r-BN)在不同类型的碳化硅(SiC)上的外延生长。关于r-BN膜的晶体质量,我们研究了沉积温度,前驱体比率(N / B)以及向气体混合物中添加微量硅的影响。通过X射线衍射和透射电镜观察,我们发现SiC衬底的Si面上外延r-BN的最佳生长温度为1500摄氏度,N / B比为642,并且不需要存在硅不仅在沉积过程中存在于气体混合物中,而且还存在于基材表面上。这种条件导致c轴与块状材料的c轴相同且厚度为200 nm的膜的生长,这有望用于电子应用的BN膜的开发。

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